


| Code | HYG812A01021A | Customer PN |
|
|
|
| Layer | 1 | Blind/Buried Via | NO |
|
|
| Base Material |
ALU |
Unit Size(mm) |
5.5000 |
X |
590.0000 |
| Board thickness | 0.8mm | Panle Size(mm) | 126.0000 | X | 590.0000 |
| Min hole | / | Pcs/Panle | 1 | X | 20 |
| Total Holes | / | Copper OZ(finish) | 1OZ | Base Cu | / |
| W/S(mil) |
/ |
Min Hole Copper Thickness | / |
|
|
| Outline Finish |
CNC+V-CUT |
Finish thickness tolerance | +/-10% |
|
|
| Contour tolerance | +/-0.15mm |
Surface Finishing |
HASL Lead Free |
|
|
| X-out | 3X | Solder Mask | White |
|
|
| Special request | Ink thickness is not less than 10um, process edge and UL mark, cycle | Silkscreen | Black |
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.